Product highlights
■ FOV up to 2100 during testing
■ 11 degrees of freedom for improved calibration quality
■ Highly configurable settings
Easily switch between high-volume or high UPH production sequences
A wide range of user-defined process parameters
Sensor leveling significantly improves calibration results
■Automatic and precise loading/unloading for high-volume production
Scalable for in-line use
■Production cleanliness reaches Class 100
ASMPT's Active Alignment machines are technologically advanced. This machine monitors the position and posture of optical components in real time and uses a sophisticated motion control system to actively adjust to ensure that key components such as lenses and sensors achieve the best relative position and angle, thereby significantly improving the imaging quality and overall performance of the module. ASMPT's MEGA, LA-PRO and NANO product lines demonstrate its innovation and technological strength in the field of packaging equipment. For example, MEGA has high-speed and accurate chip placement capabilities, LA-PRO uses high-resolution images for precise placement, and NANO has the ability to align optical components with high precision.