die bonder

die bonder

die bonder

‌ ‌Crystal bonder‌, also known as wafer loading machine or wafer pasting machine, is a machine used to fix crystals and semiconductor packages. Its main function is to grab the chip from the wafer and place it on the substrate, and use silver glue to bond the chip and substrate together. The crystal bonder plays a key role in the semiconductor packaging process, especially in the chip mounting process. It is one of the core equipment for packaging and testing‌

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