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The ASM AD832i die bonder significantly improves production efficiency through its efficient workflow and automated operation
The die bonder is designed to be flexible and can handle motherboards of various sizes and shapes
The equipment has high-precision performance and can achieve precision control of ±7um@3σ and ±1°@3σ
AD8312 Plus positioning die bonder combines the advantages of ultra-fast and positioning
The AD420XL die bonder is designed with efficiency in mind and can provide high-speed die bonding solutions
The ASM die bonder SD8312 adopts advanced control systems and mechanical structures
The system can handle multi-chip and multi-process applications in one machine
The AD280 Plus die bonder has high-precision die bonding capabilities, which can ensure the precise placement of components
Production capacity Datacon 8800 has extremely high production efficiency and can significantly improve production speed. For example
●TO-can packaging processing capability
Able to handle small molds (as low as 3 mil) and large substrates (up to 270 x 100 mm), suitable for a variety of application scenarios.
The die bonder is also equipped with other auxiliary equipment, such as fans and cooling devices
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As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
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