Semiconductor Package chip cleaning machine SC810

SC-810 is an integrated fully automatic semiconductor package chip online cleaning machine, which is used for online precision cleaning of residual flux and organic and inorganic pollutants after welding of semiconductor devices such as Lead frame, IGBTIMP, I module, etc. It is suitable for large-scale ultra-precision chip centralized cleaning, taking into account cleaning efficiency and cleaning effect. Product Features

1. Precision online cleaning system for large-scale semiconductor package chips.

2. Spray cleaning method, efficient removal of flux and organic and inorganic pollutants.

3. Chemical cleaning + DI water rinsing + hot air drying process is completed in sequence.

4. Cleaning liquid is automatically added; DI water is automatically added.

5. The cleaning liquid injection pressure is adjustable to correspond to different cleaning requirements.

6. With large flow and high pressure, the cleaning liquid and DI water can fully penetrate into the tiny gaps of the device and clean thoroughly.

7. Equipped with a rinsing positive rate monitoring system, the water quality of the rinsing DI water can be detected.

8. Wind knife wind cutting + ultra-long hot air circulation drying system,

9. PLC control system, Chinese/English operation interface, convenient program setting, modification, storage and call

10. SUS304 stainless steel body, pipes and parts, resistant to high temperature, acidic, alkaline and other cleaning fluids.

11. Can be connected with front and rear equipment to form an automatic cleaning line.

12. A variety of optional configurations such as cleaning fluid concentration monitoring

The main function of the fully automatic semiconductor packaging chip online cleaning machine is to be used for online precision cleaning of residual flux and organic and inorganic pollutants after welding of semiconductor devices such as Lead frame, IGBT, IMP, IC module, etc. The equipment is suitable for ultra-precision cleaning of large quantities of chips, taking into account cleaning efficiency and cleaning effect. Its main functions and features include:

‌High-efficiency cleaning‌: Spray cleaning method is adopted to efficiently remove flux and organic and inorganic pollutants. The cleaning fluid spray pressure can be adjusted to correspond to different cleaning requirements to ensure thorough cleaning‌.

‌Automatic operation‌: Equipped with PLC control system, Chinese/English operation interface, the program is easy to set, change, store and call. The equipment can automatically add cleaning liquid and DI water to complete the chemical cleaning, DI water rinsing and hot air drying processes.

‌High cleanliness‌: Use high-purity chemical solutions and high-purity water to ensure that the chip surface is free of oil, dust and other pollutants after cleaning. Equipped with a rinsing resistivity monitoring system to detect the quality of rinsing DI water.

‌Environmental protection‌: Use recycled chemical solutions and high-purity water to reduce wastewater discharge. Some equipment is also equipped with filtering and recycling systems to further improve resource utilization.

‌Safety‌: Automated operation reduces the risk of manual contact with harmful chemicals, and the equipment is usually equipped with safety protection measures such as leak prevention, fire prevention, and explosion prevention.