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The main functions of the SMT nozzle cleaning machine include efficient cleaning, reduced maintenance costs, improved production yield and easy operation. Its advantages are mainly reflected in the following aspects:
Clean and efficient: The SMT nozzle cleaning machine uses advanced technologies such as ultrasound or high-pressure airflow to completely remove dirt and impurities on the nozzle in a short time. The cleaned nozzle can more accurately absorb and place electronic components, thereby improving the accuracy of the patch and reducing the defective rate
Reduced maintenance costs: By extending the service life of the nozzle, the cost of frequently replacing the nozzle is reduced, including the cost of purchasing new nozzles and the time cost of stopping the machine to replace the nozzle
In addition, the cleaning machine adopts a non-destructive cleaning method to ensure that the nozzle is not damaged during the cleaning process, further reducing maintenance costs
Improve production yield: The suction accuracy of the cleaned nozzle is higher, reducing mounting errors and rework costs. The intelligent detection function can also detect and solve potential problems in a timely manner, avoiding production delays and product quality problems caused by nozzle problems
Easy to operate: The SMT nozzle cleaning machine is simple to operate and suitable for mass production environments. The equipment is humanized in design, with false alarm and emergency brake system, and overload protection system to ensure safe and reliable operation.
Ensure production stability: Clean nozzles can ensure the normal operation of the placement machine, reduce downtime caused by nozzle blockage or contamination, and improve the stability and continuity of the production line.
In addition, automated cleaning reduces manual participation and improves the automation level and stability of the production line.
Advantages of handling micro-components: When handling micro-components (such as 0201, 0402, etc.), the nozzle cleaning machine can effectively remove pollutants such as dust, oil and solder paste residue on the nozzle, ensuring that the suction force of the nozzle is uniform and stable, thereby improving the accuracy of component placement and reducing the throw rate.
