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pick and place machine FAQ
The ASM placement machine D4i is equipped with four cantilevers and four 12-nozzle collection placement heads
The design of the ASM SIPLACE SX1 achieves high flexibility. It is the only platform in the world that can expand or reduce production capacity by adding or removing the unique SX cantilever
The X4iS placement machine ensures product consistency and reliability through a unique digital imaging system and intelligent sensors
The ASSEMBLEON AX201 placement machine has high-precision placement capabilities
The advantages of the ASSEMBLEON AX301 placement machine mainly include high output, high flexibility and high precision
The working principle of the ASSEMBLEON AX501 placement machine is to control the movement of the robot arm through an automated control system
The Hitachi Sigma G5 chip mounter adopts a turret placement head, which can achieve fast, versatile and high-operation rate placement operations
The parts camera on the SMT head identifies the center offset and deflection of the components on the nozzle
The SMT head picks up components through a vacuum nozzle, and the nozzle must move quickly and smoothly in the Z direction
The SI-G200 SMT machine has a high-speed SMT function, with a mounting speed of up to 55,000 pieces per hour
The X3 SMT machine has high-precision placement capability, with a placement accuracy of up to ±41μm/3σ
Operation steps: including production operation preparation, operation process, end steps and simple troubleshooting
Operation steps: including production operation preparation, operation process, end steps and simple troubleshooting.
Hitachi G4 SMT can complete the placement of a large number of electronic components in a very short time through its advanced mechanical structure and control system
TCM-X300 has high-speed placement capability, which can quickly and accurately complete the placement of various components and improve production efficiency.
Hitachi TCM-X200 is a high-speed placement machine with high automation and high placement accuracy.
Philips iFlex T2 is an innovative, intelligent and flexible surface mount technology (SMT) solution launched by Asbeon.
iFlex adheres to the most flexible "one machine for multiple uses" concept in the industry today
The FuzionOF chip mounter has a production speed of up to 16,500 cph
The vacuum suction nozzle on the SMT head takes the component at the picking position
Maximum substrate processing size is 635mm x 610mm, and maximum wafer size is 300mm (12 inches)
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As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
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