Bentron SPI 7700E's advantages mainly include the following aspects:
High-precision detection: Bentron SPI 7700E adopts 2D+3D algorithm, which can provide high-precision solder paste thickness detection to ensure welding quality
High degree of automation: The equipment is a fully automatic optical instrument, suitable for online detection on the production line, which improves production efficiency and detection accuracy Wide range of application: Suitable for a variety of application scenarios of SMT welding, able to meet different production needs Dual 3D light source: Combining 2D and 3D technology, effectively eliminate the influence of shadows, provide high-quality 3D images, and ensure high precision and high speed of testing . 64-bit Win 7 system: Provide high-speed and high-stability computer system configuration to meet the needs of complex product design True color 3D image: Through the patented Color XY technology, it can distinguish copper foil, accurately find the zero reference plane, and display true color 3D images rotated at any angle, making it easier for users to see clear solder paste images . Board bending compensation: Provide more accurate height calculation and better repeatability data through a larger zero reference plane search range.
Foreign matter detection: Adopts Color XY algorithm to distinguish foreign matter and PCB substrate, suitable for PCBs of various colors.
Powerful SPC function: Real-time monitoring and analysis of bad data in the production process, providing detailed SPC reports, and supporting output in multiple formats.
These features make the Benchuang SPI 7700E perform well in the field of SMT patch, and it is widely used in automotive electronics, 3C manufacturing, military and aerospace industries, and is favored by SMT patch manufacturers.