‌Mirtec 3d aoi systems MV-7DL

Mirtec AOI MV-7DL is an inline automated optical inspection system designed to inspect and identify components and defects on circuit boards. ‌

Features and Applications

‌High-resolution cameras‌: The MV-7DL is equipped with a top-view camera with a native resolution of 4 megapixels (2,048 x 2,048) and four side-view cameras with a native resolution of 2 megapixels (1,600 x 1,200). ‌Four-corner lighting system‌: The system has four independently programmable zones to provide optimal lighting for a variety of inspection needs. ‌High-speed inspection‌: The MV-7DL has a maximum inspection speed of 4,940 mm/s (7.657 in/s), making it particularly suitable for ultra-high-speed PCB inspection. ‌Intelligent scanning laser system‌: With "3D inspection capability", it can accurately measure the Z-axis height of a specific area, suitable for lifted pin inspection and ball grid array (BGA) measurement of gull-wing devices. ‌

‌Precision motion control system‌: With high reproducibility and repeatability, it ensures the accuracy of inspection‌.

‌Powerful OCR engine‌: capable of advanced component recognition and inspection‌.

Technical parameters‌Substrate size‌: standard 350×250mm, large 500×400mm‌Substrate thickness‌: 0.5mm-3mm‌Number of placement heads‌: 1 head, 6 nozzles‌Resolution value‌: 10 million pixels (2,048×2,048 pixels)‌Test speed‌: 4 million pixels per second 4.940m²/sec‌Application scenariosMV-7DL is suitable for the inspection needs of various circuit board production lines, especially those that require high-precision and high-speed inspection. Its powerful functions and efficient performance make it an important tool for modern electronic manufacturing industry

Detailed explanation of working principle

‌3D imaging technology‌: Mirtec AOI MV-7DL adopts moiré projection technology to obtain 3D images without blind spots through 4 3D emission heads, and combines high and low frequency moiré fringes for component height inspection to ensure the accuracy of inspection‌.

‌High-resolution camera‌: The device is equipped with a 15-megapixel main camera and 4 high-resolution side cameras, which can perform more accurate and stable inspections, and even tiny defects can be captured. ‌Multi-angle inspection‌: Through multi-angle lighting and camera shooting, the device can effectively detect shadow deformation and provide a full range of inspection perspectives. ‌Color lighting system‌: The 8-segment color lighting system synthesizes high-definition images according to different lighting systems for accurate inspection. ‌Intellisys connection system‌: Supports remote control, improves inspection efficiency and reduces manpower consumption