Used Automatic SMT Solder Paste Inspection Machine 3D SPI

Product DescriptionKY8080 SMT Solder Paste Inspection Machine 3D SPIDetails1. 3D detection can solve the problem of light source shadow2. Achieve rapid detection in the industry while maintaining high

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Description

Product Description

KY8080 SMT Solder Paste Inspection Machine 3D SPI

Details
1. 3D detection can solve the problem of light source shadow
2. Achieve rapid detection in the industry while maintaining high accuracy
3. Easy operation
4. Powerful SPC statistical management

5. The bent PCB affects the reliability of the detection value and is processed in the way of 3D compensation.


ModelKY8080
FunctionHigh temperature resistance
Automatic gradeAutomation
Machine dimension800*1335*1627mm
Board SizeSingle Lane 50×50 - 350×330mm
Dual Lane 50×50 -  350×580mm
Fov Size36*36mm
Power220V,10A
Weight Single lane:600kgs
Dual lane: 650kgs
All pressure4-6 bar
Maximum loading PCB size X330*Y350mm
CertificationCE. ISO. RoHS
Transport PackageStandard wooden package
Measurements:volume,acreage,height, XY offset, shape
Detection of Non-Performing Typesmissing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination
Lens Resolution4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um
Accuracy:XY (Resolution)20um
Repeatabilityheight:≤1um (3 Sigma);volume/acreage:<1%(3 Sigma)
Gage R&R<<10%
Inspection Speed0.35sec/FOV-0.5sec/FOV
Mark-point Detection Time0.3sec/piece
Maximun Meauring Head±550um (±1200um as option)
Maximun Measuring Height of PCB Warp±5um
Minimun Pad Spacing100um
Minimum element01005/03015/008004  01005/03015/008004
Maximun Loading PCB Size(X*Y)450x500mm(B) 470x500mm (C) 630x686mm
Equipment repeatability accuracy<10% (5 Sigma)


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