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The AK-480 applies adhesive dots to a PCB before SMD placement. A timed pulse of compressed air drives adhesive through a dispensing needle as the machine moves between programmed locations. In a process that uses adhesive to hold parts through later handling or soldering, the deposit must sit within the component footprint and clear the solder pads after the part is placed.
Main application | Adhesive dots for SMD bonding |
|---|---|
Dispensing method | Pneumatic needle dispensing |
Quote details | Adhesive grade, dot count per panel and board support requirements |
Needle diameter, pressure and dispense time all affect the dot. Adhesive that thickens during a shift can change the deposit size, and a panel that sits unevenly can change the distance between the needle and the board. A sample run should include the smallest dot on the board and the positions where the board is hardest to support. Inspect the dots before placement and check how far the adhesive spreads once the component is seated.
Information for a quote
Send the PCB dimensions, adhesive grade, required dot size and number of dots per panel. If the board already has parts on the underside, include their height and location for the support layout. For integration into an existing SMT line, identify the required conveyor height, board flow and loading method so the AK-480 configuration can be checked against your line.
