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The MIRTEC MV-6e OMNI brings three-dimensional measurement to PCB assembly inspection, adding component height and shape information to conventional image-based checks. This helps distinguish placement defects that can be difficult to judge from colour and contrast alone.
Missing components, shifted packages and lifted or tilted parts require different inspection criteria. By evaluating the assembly in three dimensions, the MV-6e OMNI gives production teams more information when reviewing a suspected defect and deciding whether a board needs rework.
For factories moving from 2D AOI, the main benefit is the additional measurement information available at the inspection station. Camera resolution, optical configuration and software functions vary between machine generations, so we identify the offered configuration separately rather than applying specifications from the newer MV-6 OMNI to an older MV-6e OMNI.
MIRTEC MV-6e OMNI 3D AOI Specifications
| غرض | تفاصيل |
|---|---|
| نموذج | MV-6e OMNI |
| Equipment category | 3D automated optical inspection |
| Inspection object | Assembled PCBs |
| Measurement focus | Component position, height and shape |
| Camera and optical configuration | Confirm against the offered machine |
