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The main advantages of the ASMPT AD420XL die bonder include convenience, efficiency and flexibility.
Identity
The AD420XL die bonder is characterized by high precision, which can ensure the precise positioning of the chip. Its XY axis accuracy reaches ±5μm and the θ angle accuracy reaches ±0.05 degrees, which enables the precise position and angle of the chip to be guaranteed during the die bonding process, thereby improving the quality and reliability of the product.
High Efficiency
The AD420XL die bonder is designed with efficiency in mind and can provide high-speed die bonding solutions. Its processing speed has just reached 12,000 pieces, which can significantly improve production efficiency and reduce production costs in large-scale production.
Flexibility
The die bonder is suitable for a variety of application scenarios and can handle LED chips of different sizes and types. Its design takes into account the needs of a variety of chip sizes and shapes, making the equipment flexible and able to adapt to different production needs.
