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The AC-118 provides mechanical mixing during solder paste preparation before stencil printing. Mixing helps redistribute the solder powder and flux vehicle after storage, bringing the material toward a consistent condition for dispensing onto the stencil.
Preparation should follow the solder paste supplier’s instructions. Mixing does not replace the specified temperature-conditioning procedure, and excessive agitation can change the material’s temperature and behaviour.
For the AC-118, we confirm the jar dimensions, holder arrangement and permitted loading with the equipment supplied. This keeps the mixing setup matched to the paste containers already used on your production floor.
