Hanwha SP1-C SMT Solder Paste Printer for Sale

The Hanwha SP1-C handles PCBs from 50 × 50 mm to 330 × 250 mm. Its compact printing format suits assemblies that fit within this board range, with edge clamping and a top aligner holding the PCB in position during printing.

Vision alignment and printing control

The vision system recognises PCB and stencil fiducials before printing. Hanwha specifies alignment repeatability of ±12.5 μm and wet-print performance of ±25 μm, both at 6 sigma. Alignment repeatability describes the positioning capability; wet-print performance relates to the deposited solder paste.

Print speed reaches 200 mm/s, with a print-force range of 4–15 kgf. Adjustable stencil separation speed and distance allow the release movement to be set around the paste and aperture requirements.

SPI feedback and automatic leveling

The SP1-C supports automatic print-offset correction through feedback from compatible SPI equipment. Stage auto leveling sets the printing height using the squeegee-head height sensor.

Its three-stage conveyor separates board entry, printing and exit. The published machine cycle is five seconds excluding printing time, so the complete production cycle also depends on the print stroke and cleaning sequence.

We supply used SP1-C printers with the installed tooling, cleaning equipment and software configuration listed in the machine offer.

Hanwha SP1-C Core Technical Specifications