MPM Momentum BTB SMT Solder Paste Stencil Printer

The MPM Momentum BTB gives SMT manufacturers a choice between a single-printer installation and a two-printer, back-to-back arrangement. Two BTB machines can serve a dual-lane line without increasing line length, while the individual printers can be redeployed as production requirements change.

Front access to electrical systems and solvent reservoirs supports maintenance in the back-to-back layout. This arrangement is a defining feature of the BTB platform, especially where access between adjacent machines is limited.

For printing performance, MPM specifies total system alignment accuracy and repeatability of ±12.5 μm, with wet print deposit accuracy and repeatability of ±20 μm, both at 6σ and Cpk ≥2.0. These are separate specifications: alignment capability describes the positioning system, while wet print performance reflects the deposited solder paste.

Available process options include RapidClean stencil cleaning, EnclosedFlow printing and SPI Print Optimizer feedback. We identify the installed printing, cleaning and inspection options in the equipment offer, together with the board tooling supplied.

MPM Momentum BTB Core Technical Specifications

A dedicated workholder is required for boards exceeding 508 mm in the X direction. Published cycle time is not the complete production cycle, which also depends on printing, inspection and cleaning settings.