product
ASMPT die bonding machine AD8312 Plus

ASMPT ekyuma ekisiba ekifa AD8312 Plus

AD8312 Plus positioning die bonder egatta ebirungi ebiri mu ultra-fast ne positioning

Ebisingawo

Ebirungi bya ASMPT die bonder AD8312 Plus okusinga mulimu ultra-fast and positioning, enkola ennungi ennyo ey’okufuga okutonnya kwa glue n’obusobozi bw’okulongoosa obusaanira high-density fiber optic frames

Ebirungi ebitongole

Ultra-fast ne positioning: AD8312 Plus positioning die bonder egatta ebirungi bya ultra-fast ne positioning, esobola okumaliriza obulungi omulimu gwa die bonding, n'okukakasa positioning die bonding effect

Enkola ennungi ennyo ey’okufuga okutonnya kwa kalaamu: Enkola ennungi ennyo ey’okufuga okutonnya kwa kalaamu ey’ekyuma kino esobola okufuga obulungi enkola y’okutonnya kwa kalaamu okukakasa omutindo n’obutebenkevu bw’okusiba okufa

Esaanira ku fuleemu ezisoma eza density enkulu: Enkola ya AD8312 Plus eya universal worktable design esaanira okukola ku fuleemu z’okusoma ezirina density enkulu okusobola okutuukiriza ebyetaago by’obutale obw’enjawulo

Ensonga ezikozesebwa n’okwekenneenya kw’abakozesa

AD8312 Plus esaanira okukozesebwa mu nkola ya integrated circuit ne discrete component naddala okukola emirimu gya yinsi 12 egya wafer die bonding. Obusobozi bwayo obw’amaanyi n’omugabo ogukyukakyuka bitaddewo omutindo omupya ku katale era esobola okutuukiriza ebisaanyizo eby’enjawulo ebizibu eby’okukozesa

3f9d25261fb1306
GEEKVALUE

Geekvalue: Yazaalibwa ku byuma ebilonda n’okuteeka

Omukulembeze w'okugonjoola ensonga emu ku chip mounter

Ebitukwatako

Ng’omugabi w’ebyuma eri abakola ebyuma, Geekvalue ekuwa ebyuma ebipya n’ebikozesebwa n’ebikozesebwa okuva mu bika eby’amaanyi ku bbeeyi evuganya ennyo.

© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS

kfweixin

Sikaani okugattako WeChat