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The BTU Pyramax 100 combines eight upper and eight lower heating zones with a 2,540 mm heated tunnel. This arrangement provides room to develop the preheat, soak and reflow stages of a soldering profile while adjusting conveyor speed to the assembly’s thermal requirements.
Forced-convection heating transfers heat across the PCB and its components. On boards carrying both small passive components and larger, heat-absorbing packages, the process objective is to bring solder joints into the required temperature window without exceeding component limits. Independently controlled zones give process engineers the adjustments needed to develop that profile.
The Pyramax 100A operates in air, while the 100N supports air or nitrogen processing. Cooling arrangements also differ between versions, making the complete model designation important when comparing machines.
We discuss the Pyramax 100 against your PCB dimensions, solder paste requirements and expected line output. The offered conveyor, centre-board support and atmosphere-control equipment are identified separately so the quotation reflects the actual oven configuration.
BTU Pyramax 100 Reflow Oven Specifications
| Tūemi | Whakatakotoranga |
|---|---|
| Equipment type | Inline convection reflow oven |
| Heating zones | 8 upper / 8 lower |
| Heated length | 2,540 mm |
| Atmosphere | 100A: air; 100N: air or nitrogen |
| Published conveyor width range | 51–457 mm |
| Published conveyor speed range | 250–1,520 mm/min |
| Standard maximum temperature | 350°C; confirm machine version |
| Cooling configuration | Model and option dependent |
