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A six-nozzle laser head and a separate single-nozzle high-resolution head give the JUKI KE-2080M its mixed-placement capability. The arrangement allows chip components and larger packages to be handled through different recognition and placement paths within one machine.
That distinction matters on assemblies where IC placement accounts for a meaningful share of the workload. Checking only the chip placement rate leaves out the work performed by the high-resolution head, including component recognition and the handling of larger packages.
The “M” designation also needs to remain visible in the product listing. PCB capacity should match the offered KE-2080M configuration; specifications from KE-2080L or KE-2080E machines should not be carried across.
For a quotation, send us the largest component dimensions, package types and board size. These details help establish the required camera, nozzle and feeding arrangement.
