BGA rework station R7220A

The main functions of the BGA rework station include precise removal of damaged chips, preparation of soldering surfaces, re-soldering of chips, inspection and calibration, and improving repair efficiency. Specifically:

‌Precise removal of damaged chips‌: The BGA rework station can provide uniform and controlled heat to melt the solder balls around the chip, thereby achieving non-destructive removal of the chip. By controlling the heating zones and temperature profiles, the rework station can ensure that the circuit board or other components are not damaged during removal.

‌Prepare soldering surface‌: After removing the chip, the rework station can help remove residual solder on the PCB board and provide a clean and flat surface for re-soldering. This step is crucial to ensure the quality of soldering of the new chip.

‌Re-soldering Chips‌: The rework station is equipped with a high-precision alignment system and a heating platform, which can accurately place the new BGA chip in the designated position, ensuring that all solder balls are perfectly aligned with the corresponding pads. By uniformly heating, the rework station can achieve reliable reflow soldering, improve the firmness of solder joints, and reduce the possibility of false solder joints and cold solder joints.

‌Inspection and Calibration‌: High-end BGA rework stations are equipped with optical inspection systems and X-ray inspection equipment, which can perform visual inspection and internal defect detection before and after welding to ensure welding quality‌

‌Improve repair efficiency‌: Modern BGA rework stations usually support a certain degree of automated operation to reduce manual intervention and improve repair efficiency. The intuitive user interface allows operators to easily set parameters and monitor the process, lowering the technical threshold‌

The importance of BGA rework station in electronic equipment repair is reflected in the following aspects:

Improve maintenance efficiency: BGA rework station can quickly and accurately complete the maintenance of BGA chips, greatly improving maintenance efficiency

‌ Reduced repair costs ‌: By repairing failed chips rather than replacing the entire board or device, the BGA rework station reduces repair costs ‌

‌Guaranteed repair quality‌: Precise temperature control, optical alignment system and inspection functions ensure the installation and soldering quality of BGA chips‌

In terms of application scope, the BGA rework station can be used not only for small electronic devices such as mobile phones, tablet computers, and laptops, but also for large electronic devices such as servers and industrial control equipment, and has a wide range of application prospects.