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die cutting machine

die cutting machine

die cutting machine

‌ Wafer sawing machine‌, also known as wafer dicing machine, is a device used to cut wafers into individual chips. Wafer sawing is an important part of the semiconductor manufacturing process. Its purpose is to separate wafers that have undergone multiple processes into multiple independent dies. These dies usually contain complete circuit functions and are the core components used to manufacture electronic products.‌

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GEEKVALUE

Geekvalue: Born for Pick-and-Place Machines

One-stop solution leader for chip mounter

About Us

As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.

Contact address: No. 18, Shangliao Industrial Road, Shajing Town, Baoan District, Shenzhen, China

Consultation phone number: +86 13823218491

Email: smt-sales9@gdxinling.cn

CONTACT US

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