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DISCO DFD6341 is a high-performance double-precision cutting machine with obvious advantages and functions, suitable for processing 8-inch wafers.
Advantages
Improved productivity: The DFD6341 uses a unique rotary mechanism, the speed return of the X axis is increased to 1000 mm/s, the lifting performance of each axis is also improved, and the moving range at the highest speed is expanded, thereby improving productivity
In addition, the processing time of dual-axis cutting is reduced by optimizing the distance between parts and total turnover
Space saving: Compared with the previous peripheral device DFD6340, the DFD6341 is reduced by about 3%, and the transformer, UPS (emergency power supply device), CO2 injector and booster pump are built-in, increasing the floor space
Convenient operation: The combination of a graphical user interface (GUI) and an LCD touch screen is adopted to achieve convenient operation and improve the operability of the equipment
Trigger layout: The optional combination of a flash light and a high-speed grating CCD can be adjusted without stopping the workbench at high speed, reducing the trigger time and further improving production efficiency
Functions
Cutting speed and accuracy: The maximum cutting speed of the DFD6341 reaches 1000 mm/s, positioning accuracy within 0.002 mm, suitable for precision cutting needs
Versatility: The device is suitable for wafer processing of various sizes, supporting wafer processing from 8 inches to 300 mm, suitable for a variety of application scenarios
Efficient adjustment: The optional high-speed flash adjustment function, through the combination of keyboard gas flash and high-speed lightning CCD, can be adjusted while moving at high speed, reducing adjustment time
