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The main advantages and specifications of the ASM semiconductor laminator ORCAS series are as follows:
Advantages
Glory and stability: The closed-loop coplanarity (TTV) of the ORCAS manual molding system is less than 20μm, ensuring high-precision laminating effects
Versatility: The system supports a variety of substrate types, including fillets (size SQ340mm) and flexible (F8” and F12”), suitable for a variety of application scenarios
Efficient production: The system supports sequential bidirectional molding of panels or wafers, improving production efficiency and flexibility
Specifications
Load capacity: The load capacity of the ORCAS manual molding system is 60T, suitable for handling heavy-duty laminating tasks
Liquid spray device: Equipped with and particle spray device, providing a variety of liquid spray mode options to meet different laminating needs
Applicable substrates: Supports a variety of substrate types such as fillets and flexible, suitable for different production needs
These advantages and specifications make the ASM semiconductor laminator ORCAS series perform well in the field of semiconductor packaging, suitable for high-precision and high-efficiency production needs
