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Iingenelo eziphambili kunye neenkcukacha ze-ASM semiconductor laminator ORCAS series zezi zilandelayo:
Iingenelo
Uzuko kunye nokuzinza: I-coplanarity evaliweyo (i-TTV) ye-ORCAS inkqubo yokubumba i-manual ingaphantsi kwe-20μm, iqinisekisa iziphumo zokuchaneka okuphezulu.
I-Versatility: Inkqubo isekela iintlobo ezahlukeneyo ze-substrate, kubandakanywa iifayili (ubukhulu be-SQ340mm) kunye ne-flexible (F8" kunye ne-F12"), ezifanelekileyo kwiimeko ezahlukeneyo zesicelo.
Imveliso esebenzayo: Inkqubo ixhasa ukubunjwa kwe-bidirectional ngokulandelelana kweepaneli okanye ii-wafers, ukuphucula ukusebenza kakuhle kwemveliso kunye nokuguquguquka.
Iinkcukacha
Umthamo womthwalo: Umthamo womthwalo we-ORCAS inkqubo yokubumba ngesandla yi-60T, ilungele ukusingatha imisebenzi enzima yokubeka i-laminating.
Isixhobo sokutshiza ngolwelo: Sixhotyiswe kunye nesixhobo sokutshiza ngamasuntswana, sibonelela ngeendlela ezahlukeneyo zokutshiza ulwelo ukuhlangabezana neemfuno ezahlukeneyo zokuthambisa.
I-substrates esebenzayo: Ixhasa iintlobo ngeentlobo ze-substrate ezifana neefayili kunye neziguquguqukayo, ezifanelekileyo kwiimfuno ezahlukeneyo zemveliso.
Ezi zibonelelo kunye neenkcukacha zenza i-ASM semiconductor laminator ye-ORCAS uchungechunge luqhube kakuhle kwintsimi yokupakisha i-semiconductor, ilungele ukuchaneka okuphezulu kunye neemfuno eziphezulu zemveliso.
