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Viscom-iS6059 is an excellent 3D automatic optical inspection system for bottom surface quality inspection. Its main functions and specifications are as follows:
Features
3D Camera Technology: iS6059 uses innovative 3D camera technology to perform shadow-free and high-precision inspection of THT components, THT solder joints, PressFit and SMD components on the front and back of printed circuit boards
Multi-dimensional inspection: The system can inspect test objects on circuit boards and workpiece carriers in 2D, 2.5D and 3D at high speed, ensuring maximum defect identification and the highest degree of throughput
Flexible lighting system: Various types of lighting can be flexibly switched to ensure that the test results are presented in the best quality
Ergonomic design: The system design focuses on ergonomics to provide a comfortable operating experience
Technical Parameters
Inspection range: For reliable 3D inspection of pin lengths of high-profile desoldering (front side) or missing pins (rear side) on THT, as well as 3D quality control of THT solder joints
Sensor solution: Adopts powerful 3D XM sensor solution for reverse quality inspection
Camera Technology: Unobstructed detection by using 8 oblique-angle cameras
Software support: Equipped with Viscom standard software to achieve optimization with the shortest time and minimum training costs
Application Scenario
iS6059 is suitable for all kinds of electronic manufacturing industries, especially for printed circuit board inspection. Its high precision and high efficiency give it a significant advantage in the field of quality control
