SAKI 3D AOI BF-3Di-MS3 Automated Optical Inspection Machine

SAKI BF-3Di-MS3 is an online 3D automatic appearance inspection machine, which belongs to the BF-3Di series of intelligent optical automatic appearance inspection equipment. The equipment adopts the digital optical height measurement technology independently developed by SAKI, and has undergone strict production verification to ensure its reliability and market maturity. The performance of BF-3Di-MS3 has been greatly improved, with a maximum resolution of 1200 pixels, a detection accuracy of 7um, suitable for semiconductor-level applications, and a detection speed of up to 5700mm²/second.

The main functions of SAKI BF-3Di-MS3 include 3D detection, automatic programming, high-precision detection and a user-friendly operation interface.

3D detection function

SAKI BF-3Di-MS3 adopts 2D+3D detection technology, which can simultaneously acquire 2D and 3D images, and calculates accurate height information using the phase system of stripe light projection. Its four-directional stripe light projection technology can avoid the influence of shadows on the detection results, and is suitable for various types of components, including 0402mm chip components, black IC bodies and mirror material components.

Automatic programming function

The device has an automatic programming function that can significantly reduce the preparation time of inspection data, and can automatically assign component libraries with high precision by referring to Gerber data and CAD data. In addition, it can automatically perform inspections that meet IPC standards by obtaining pad shape information. Using the offline debugging function, combined with past defect images and statistical information, threshold settings are automatically completed to ensure stable inspection quality regardless of the operator's skill level. Technical specifications and features

‌Automatic programming function‌: By referring to Gerber data and CAD data, the BF-3Di-MS3 can automatically assign the best component library with high precision and automatically perform inspections that meet IPC standards. The device is equipped with an offline debugging function as standard, which can automatically complete threshold settings based on statistical information to ensure stable inspection quality regardless of the operator's skills.

‌3D slice inspection‌: In the production inspection interface, 3D display slices can be performed on the components to be inspected at any time, and 3D images of components at any position and angle can be intuitively presented. ‌

‌High-precision detection‌: BF-3Di-MS3 uses a dual-axis motor and a high-rigidity gantry to achieve high-speed shooting performance and absolute accuracy in the XYZ axis, ensuring high-precision detection of the entire circuit board‌.

‌Multi-directional camera‌: Using a four-directional side-view camera for automatic detection, it can detect solder joints and pin parts that could not be detected from directly above, such as QFN, J-type pins, and connectors with covers, to ensure that there are no blind spots for detection‌.

Application scenarios and user reviews

SAKI BF-3Di-MS3 is widely used in various electronic manufacturing scenarios, especially in the semiconductor manufacturing field that requires high-precision and efficient detection. Users commented that it is easy to operate, has stable detection quality, and is suitable for various production environments. In addition, SAKI's products enjoy a high reputation in the market, especially in the field of optical detection.