The main advantages and features of the Philips HYbrid3 placement machine include:
Operation and placement: The HYbrid3 placement machine has high precision and efficient placement accuracy of up to ±7μm, and can handle components as small as 008004 (0201m) with a defect rate of less than 1dpm
The system continues to strengthen the overall process of picking and placing, and introduces a new lightweight feeder, with a pick rate of more than 99.99%, a higher placement of pixel components (35 microns), and camera alignment components. The production capacity can be improved 25%
Advanced placement technology: HYbrid3 adopts sequential placement method, through full closed-loop placement pressure control, the pressure is effective to 0.3n, ensuring the stability and accuracy of placement
Its design pays attention to details, ensuring the quality from the beginning of the board means immediate capacity improvement
Flexibility and versatility: HYbrid3 placement machine supports a variety of inventory packaging methods, including tape and reel, tube, box and tray, further improving its flexibility and applicability
In addition, it is also equipped with an intelligent tray suction and correction system that can identify a variety of different components to ensure the accuracy of placement
High efficiency and stability : The design of HYbrid3 focuses on stability and efficiency. It adopts a fixed circuit board design to ensure the stability of mounting large or heavy components.
Its mounting head has the ability of high-pressure mounting. The mounting pressure is not program-controlled and can reach up to 5kg.
Wide market application: HYbrid3 placement machine is not only suitable for nonlinear placement of semiconductor wafers, but also for SMT whole-line equipment rental to meet different production needs.
Market positioning and user evaluation: Philips HYbrid3 placement machine is positioned in the market as a high-speed/ultra-high-efficiency placement machine, suitable for electronic manufacturing companies that require position and high-efficiency production. Its quality and capabilities are widely recognized, especially in the semiconductor wafer placement and SMT whole-line equipment rental market.