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The specifications and functions of the MY300 placement machine are as follows:
Specifications
Power supply: 220V
Color: Industrial gray
Power: 1.5kW
Origin: Sweden
Track height: 900mm
Processing size: 640mm x 510mm
Substrate weight: 4kg
Station: 192
Speed: 24000
Functions
High-speed placement: The MY300 can place 224 smart feeders in a 40% smaller footprint than the previous model, significantly improving production efficiency
Versatility: The MY300 supports component placement in a variety of packaging methods, including bulk, tape, tube, tray and flip chip, suitable for components from the smallest 01005 to the largest 56mm x 56mm x 15mm components
High-precision placement: Equipped with a sturdy frame, advanced placement head technology and automated heat control, MY300 can achieve high-precision placement for advanced components such as fine-pitch IC, CSP, FLIP CHIP, MICRO-BGA, etc.
Automation function: MY300 is equipped with a fully automatic circuit board handling function, which can load and unload multiple circuit boards at the same time, significantly improving the processing volume. In addition, it also supports manual circuit board handling and online processing of special-shaped panels
Error detection and rework reduction : Through electric inspection and surface redundancy test models, MY300 can effectively reduce wear on contact surfaces and test new component types, ensuring 100% verification efficiency and reducing rework
