mpm solder paste printer edison

‌The main functions of the MPM printer Edison include a visual automatic alignment device, a slow demoulding function, a programmable scraper head, and an automatic stencil wiping system‌. Its printing cycle includes the following processes: substrate loading, substrate positioning, visual system alignment, printing platform rise, scraper forward scraping solder paste, slow demoulding, printing platform lowering, substrate loading‌

The specific operating steps of the MPM printer Edison are as follows:

After the power is turned on, the computer automatically displays the START button.

After pressing the START button, select the NEXT button, and the computer automatically performs the zeroing action.

Place the steel plate to be used, and start the FLAME CLAMP button to lock the steel plate.

Select LOAD FILE (load program), and when many file names appear on the screen, call the program file to be used.

Detect the height of the steel plate, and start the TACTILES SENSOR (sensor) to rise and detect the height of the steel plate.

Adjust the scraper level, start SQUEEGEE CLAMP, clamp the scraper, select the LEVEL SQUEEGEE button in UTILITIES, the Z axis rises, start the TACTILE SENSOR to rise, press the scraper down to adjust the level of the rear scraper first, and then adjust the level of the front scraper.

Apply solder paste (the amount of solder paste added for the first time is about 2/3 cans of 0.35kg~1 can of 0.5kg).

Select AUTO PRINT to perform automatic printing ‌

In addition, the MPM printer Edison also has the following features:

‌Visual automatic alignment device‌: ensure the accuracy of printing.

‌Slow demoulding function‌: reduce the risk of solder paste waste and substrate damage.

‌Programmable scraper head‌: adjust the scraper pressure and speed according to different needs.

‌Automatic wiping steel plate system‌: extend the service life of the steel plate and reduce maintenance requirements‌