jt smt reflow soldering oven ktd-1204-n

JT reflow oven KTD-1204-N has the following functions and specifications:

‌High production capacity‌: Normal production chain speed can reach 160cm/min, suitable for high-speed production needs‌

‌Low energy consumption‌: Adopts a new thermal management system to effectively reduce costs‌

‌High temperature control accuracy‌: Strong temperature control ability, the set and actual temperature difference is within 1.0℃; the temperature fluctuation from no-load to full-load is within 1.5℃‌

‌Fast temperature rise and fall ability‌: The temperature difference between adjacent temperature zones is within 100℃, suitable for high-speed production and high-precision PCB packaging process‌

‌Heat insulation technology‌: Adopt the latest heat insulation technology and a new furnace design to ensure that the furnace surface temperature is around room temperature + 5℃‌

‌Nitrogen control‌: The nitrogen is quantitatively controllable throughout the process, and each temperature zone is independently closed-loop controlled. The oxygen concentration range can be controlled within 50-200PPM‌

 ‌Cooling technology‌: Optional multi-zone double-sided cooling, maximum effective cooling length 1400mm, to ensure rapid cooling of products and lowest outlet temperature‌

‌Flux recovery system‌: New two-stage flux recovery system, improves recovery efficiency, reduces maintenance time and frequency‌

‌Dual-track speed change‌: Dual-track dual-speed design, energy saving 65%, improve production efficiency‌

‌Technical parameters‌:

‌Power supply‌: 380V‌

‌Dimensions‌: 731317251630‌

‌Power‌: 71/74KW‌

‌PCB height‌: 30mm on top, 25mm on bottom‌

These functions and specifications make the KTD-1204-N reflow oven perform well in a high-speed, high-efficiency, low-energy production environment, suitable for various high-precision PCB packaging process requirements.