TRI SMT 3D SPI TR7007Q SII

I-Drew SPI TR7007Q SII sisixhobo sokuhlola ushicilelo oluphezulu lwe-solder paste. Iimpawu zayo eziphambili kunye nemisebenzi ngolu hlobo lulandelayo: Isantya sokuhlola: I-TR7007Q SII inesantya sokuhlola ukuya kuthi ga kwi-200cm²/sec, okwangoku ngowona matshini wokuhlola umatshini wokushicilela we-solder okhawulezayo kushishino. Ukuchaneka kohlolo: Isixhobo sibonelela ngezisombululo ezibini ze-10µm kunye ne-15µm, kwaye samkele itekhnoloji yokukhangela ukukhanya komgca ongenasithunzi ukuqinisekisa ukuchaneka okuphezulu kwe-intanethi. Iimpawu zeNkqubo: I-TR7007Q SII inomsebenzi ovaliweyo, iteknoloji ye-imaging ye-2D ephuculweyo, umsebenzi wembuyekezo yokugoba ipleyiti ezenzekelayo kunye nobuchwepheshe bokuskena ukukhanya komgca. Injini yayo ye-XY esebenzayo ibonelela nge-vibration-free kunye nobhaqo oluchanekileyo. Iimeko ezisebenzayo: Esi sixhobo sifanelekile kwiimfuno zemigca eyahlukeneyo yokuvelisa, ngakumbi ngaphandle kokunyusa indawo yomgangatho womatshini, inokuphucula kakhulu amandla okuvelisa umgca wemveliso. Uvavanyo lomsebenzisi kunye nokuma kwemarike: I-Drew TR7007Q SII yonwabela udumo oluphezulu kwimarike yokusebenza kwayo okuphezulu kunye nokuchaneka okuphezulu. Isetyenziswa ngokubanzi kwimizila eyahlukeneyo yemveliso, ngakumbi kwiimeko ezifuna ukusebenza kakuhle okuphezulu kunye nokufumanisa ngokuchanekileyo okuphezulu. Ukufunyanwa kwayo ngokukhawuleza kunye nemisebenzi yokulawula echanekileyo yenza ukuba ibe sisixhobo esikhethiweyo sokubona imigca emininzi yemveliso. I-TR7007Q SII iyahambelana nobukhulu bebhodi yeesekethe ezahlukeneyo kunye nobukhulu, kwaye inokusingatha iibhodi zeesekethe eziprintiweyo ukuya kwi-510 x 460 mm kunye nobukhulu be-0.6-5 mm. Ubuchule bayo bokucwangcisa obunamandla buyenza ilungele iindawo ezahlukeneyo zemveliso.