Semiconductor chip ukupakisha ukupakisha umatshini wokucoca AC-420

Ukupakisha ngokupheleleyo umatshini we-semiconductor we-chip wokucoca kwi-intanethi luhlobo lwezixhobo ezenzelwe imboni yokupakisha i-chip. Isebenzisa iteknoloji yokucoca i-plasma ngokufanelekileyo nangokucokisekileyo ukususa ukungcola kwinkqubo yokupakisha i-chip ukuqinisekisa umgangatho kunye nokuthembeka kwe-chip.

Iimpawu zobugcisa kunye neendawo zokusetyenziswa

Umatshini wokupakisha we-semiconductor we-chip ozenzekelayo ozenzekelayo wokucoca kwi-intanethi ikakhulu wamkela itekhnoloji yokucoca ngokwasemzimbeni kwiplasma. Ngethuba lenkqubo yokucoca, i-plasma ephezulu yamandla inokubola ngokukhawuleza kwaye isuse ukungcola kwezinto eziphilayo kunye ne-inorganic ebusweni be-chip. Ineempawu zokucoca ngokufanelekileyo, ezikhuselekileyo nezithembekileyo, izinga eliphezulu lokuzenzekelayo, ukonga amandla kunye nokukhuselwa kwendalo. Esi sixhobo sisetyenziswa ngokubanzi kwishishini lokupakisha i-semiconductor chip, kubandakanywa ukupakishwa kwesekethe edibeneyo, indibano yokupakisha i-chip kunye nezinye iinkalo.

Amathuba emarike kunye neendlela zophuhliso lwetekhnoloji

Ngophuhliso olukhawulezayo lweshishini le-semiconductor, iimfuno zomgangatho we-chip kunye nokuthembeka ziya zinyuka nangaphezulu, kwaye ukubaluleka koomatshini bokucoca kwinkqubo yokuvelisa i-chip kuya kuphawuleka ngakumbi. Amaziko ophando lwemakethi aqikelela ukuba imakethi yokupakishwa komatshini wokucoca iplasma kwi-intanethi iya kugcina izinga lokukhula eliphezulu kwaye ibe nethemba elibanzi lemarike. Kwixesha elizayo, izixhobo ziya kuba zihlakaniphile kwaye zizenzekelayo, kwaye ziya kuqhubeka ziphucula ukusebenza kakuhle kokucoca kunye nokucoca umgangatho ukulungelelanisa utshintsho oluqhubekayo kwishishini le-semiconductor.

Olona khuphiswano luphambili lomatshini wokucoca we-semiconductor we-intanethi wokupakishwa kwe-intanethi lubonakaliswa ikakhulu kwezi nkalo zilandelayo:

Umgangatho ophezulu wokucoca umphumo: Umatshini wokucoca we-semiconductor ozenzekelayo ngokugqibeleleyo kwi-intanethi uthatha iteknoloji yokucoca ephuculweyo, enokuthi isuse ngokufanelekileyo ukungcola okuhlukahlukeneyo okwenziwe ngexesha lenkqubo yokupakisha i-chip, kuquka i-flux, i-organic and inorganic pollutants. Umphumo wayo ococekileyo wokucoca uqinisekisa ukucoceka kwe-chip kunye nokuphucula umgangatho kunye nokuthembeka kwepakethe.

Ulawulo oluchanekileyo oluphezulu: Isixhobo sixhotyiswe ngeqondo lokushisa kunye nezinzwa zenqanaba lolwelo, ezinokulawula ngokuchanekileyo ubushushu kunye nenqanaba lolwelo lwesisombululo kwitanki ukuqinisekisa ukuba iqondo lokushisa kunye nenqanaba lolwelo ngexesha lokucoca ligcinwa kwindawo engcono kakhulu, ngaloo ndlela kuphuculwe umphumo wokucoca kunye nobomi benkonzo yezixhobo.

I-Versatility: I-semiconductor chip yokupakisha ngokugqibeleleyo kwi-intanethi umatshini wokucoca i-intanethi ifanelekile ukucocwa kwezixhobo ezahlukeneyo ze-semiconductor, njenge-Lead frame, IGBT, IMP, imodyuli ye-IC, njl. nokuba bhetyebhetye