Abashicileli bechungechunge lwe-EKRA X4 banomgangatho ophezulu woshicilelo oluchanekileyo, onokuqinisekisa ukuphuculwa okuzinzileyo kwemveliso yemveliso.

I-Hanwha SP1-CW yiprinta ye-solder ethembekileyo yokuncamathisela eyenzelwe imigca yemveliso ye-SMT yangoku. Sinikezela ngeeyunithi ezintsha, ezisetyenzisiweyo, nezihlaziyiweyo ze-SP1-CW ukuxhasa uhlahlo lwabiwo-mali olwahlukeneyo kunye neemfuno zokwenziwa.

I-DEK TQL ilungele iimeko ezifuna ukuchaneka okuphezulu kunye nobukhulu obukhulu bebhodi yesekethe yoshicilelo.

I-Oven ye-JT Reflow NS-800Ⅱ-N isetyenziselwa ikakhulu ukuwelda, ilungele iimfuno zemveliso yeendibano zocweyo ze-SMT.

Amandla okulawula ubushushu obunamandla, iseti kunye nokwenyani umahluko wobushushu ungaphakathi kwe-1.0 ℃

I-JT Reflow Oven i-JIR-800-N ithatha itekhnoloji yokufudumeza ephezulu, enokunyusa ngokukhawuleza nangokulinganayo iqondo lobushushu kwiziko ukuqinisekisa inkqubo esebenzayo yokuwelda.

Ixesha lomjikelo woshicilelo yimizuzwana emi-5 (ngaphandle kwexesha lokushicilela), elilungele iimfuno zokuvelisa ngesantya esiphezulu.

Ukuchaneka koshicilelo lwe-SP2-C yomshicileli we-solder paste yi ±15um@6σ, kunye nokuchaneka okumanzi koshicilelo yi-±25um@6σ.

I-Samsung SM451 ngumatshini wokubeka ohamba ngesantya esiphezulu, osetyenziswa ikakhulu ukubeka izinto ezinokwakheka okukhethekileyo.

I-oven ye-NC06-8 yokuphinda iphinde iphinde isetyenziswe inamandla aphantsi kakhulu, engaphantsi kwe-30% ngaphantsi kwemodeli endala.

Isixhobo samkela itekhnoloji ye-vacuum reflow, enokunciphisa kakhulu i-voids kwi-solder kwaye iqinisekise umgangatho wokuwelda.

Umatshini weplagi we-Mirae MAI-H8T sisixhobo sofakelo esizenzekelayo esisebenzisa itekhnoloji ye-SMT patch kwaye ilungele amacandelo aphuma kumngxuma.