I-SHEC 3U105-8529 yintloko yoshicilelo lwe-thermal ye-300dpi eyenzelwe ukuchaneka okuphezulu kwe-industrial-grade printing. Yamkela itekhnoloji yokuvelisa echanekileyo yaseJapan kwaye iqhuba ngokugqwesileyo kwiimeko ezifana nokuxilongwa kwezonyango, ukuleyibheli ngokuchanekileyo, kunye nokumakishwa kwecandelo lombane. Iimpawu zayo ezingundoqo zingashwankathelwa ngolu hlobo lulandelayo:
Ulawulo lwe-matrix yamachaphaza e-Ultra-fine: amachaphaza angama-5.67/mm indawo yokufudumeza yoxinaniso, ukufikelela kwi-40% ekuphuculeni okubukhali kweemveliso eziprintiweyo (xa kuthelekiswa neemodeli ezingama-200dpi)
Impendulo ye-thermal ye-Nano-level: usebenzisa i-aluminium entsha ye-nitride ye-ceramic substrate, ukusebenza kakuhle kwe-thermal conductivity yi-25% ephezulu kuneyezinto zemveli.
Ukuqina komgangatho womkhosi: kuphumelele iiyure ezili-1000 zovavanyo lokutshiza ityuwa kunye namaxesha angama-500,000 ovavanyo lokungcangcazela kwempembelelo.
II. Ukuphumelela iteknoloji entsha
Inkqubo yeMbuyekezo yaMandla aNgqongileyo (DECS)
Ixesha langempela lokujonga utshintsho lwe-impedance kwindawo nganye yokufudumeza
Ihlawula ngokuzenzekelayo i-±15% yokuguquguquka kwamandla
Iqinisekisa ukuhambelana kwe-grayscale ye-ΔE <1.5 ngexesha loshicilelo oluqhubekayo
Ulwakhiwo olunemigangatho emithathu yokuchitha ubushushu
Uyilo olulodwa lomjelo wokuphelisa ubushushu
Idityaniswe ne-algorithm yokupholisa umoya
Igcina ubushushu bokusebenza obuqhubekayo buzinzile kuma-65±2℃
Ukukhuselwa koqhagamshelwano olukrelekrele
I-IC edityanisiweyo yokujongwa kwe-impedance
Unqumla iisekethe ezingaqhelekanga ngaphakathi kwe-0.1ms
Yehlisa umngcipheko we-electrode oxidation ngama-90%
III. Iiparamitha zentsebenzo ekhokelayo kwishishini
Isalathisi sexabiso leParameter yokulinganisa umgangatho weShishini
Ubuncinci ibhakhowudi eyaziwayo 0.08mm ububanzi beDathaMatrix Uhlobo oluqhelekileyo 0.15mm
Inqanaba leGreyscale Amanqanaba angama-256 (ulawulo lwe-8bit) Imveliso eqhelekileyo amanqanaba angama-64
Ixesha lokuphendula lokuqalisa i-23ms (ukusuka kwi-standby ukuya kushicilelo lokuqala) Iimveliso ezifanayo 50ms +
Ifilimu yeCarbon adhesion 5N/mm² (JIS K5600 standard) Uhlobo oluqhelekileyo 3N/mm²
IV. Ukusebenza kwiimeko ezikhethekileyo zesicelo
Ubume bonyango lokuvala inzala
Ukumelana nemijikelo ye-100 yoxinzelelo oluphezulu lokuvala umphunga
Gcina ukusebenza okuzinzileyo kwiiyure ezingama-2000 kwindawo yokuvala inzala ye-ETO
Uphumelele isiqinisekiso se-ISO 13485 sesixhobo sonyango
Iimeko zobushushu obugqithisileyo
-30 ℃ ixesha lokuqala elibandayo <3 imizuzwana
70℃ okusingqongileyo okuqhubekayo ukusebenza izinga lokuthomalalisa <5%
Thobela umgangatho womkhosi we-MIL-STD-810G
V. Umjikelo wobomi kunye neenzuzo zokulondolozwa
Inkqubo yokuzixilonga:
Ixesha langempela lokujonga izinga lokuthomalalisa indawo yokufudumeza
Ukuqikelelwa komjikelo wolondolozo kwiiyure ezingama-200 kwangaphambili
Ukutshintshwa kwemodyuli:
Inkxaso yokutshintshwa kokutshintsha okushushu (isakhiwo esinelungelo elilodwa lomenzi-ukukhutshwa ngokukhawuleza)
Ixesha lokutshintshwa <3 imizuzu
Uyilo lokusingqongileyo:
I-95% yamacandelo ayarisayikilishwa
I-RoHS iyahambelana ne-3.0+FIKELA kwizinto ezingama-239
VI. Idatha yovavanyo yokuthelekisa yezicelo eziqhelekileyo
Kumgca wokupakisha wefoyile ye-aluminiyam yeyeza:
Shicilela ukucaca: 3U105-8529 izinga lokuqaphela i-99.98% vs. 98.2% yeemveliso ezikhuphisanayo
Izinga lokungaphumeleli kwenyanga: 0.3 amaxesha/1,000 iiyunithi vs. umndilili woshishino 2.1 amaxesha/1,000 iiyunithi
Ukugcinwa kweribhoni yemihla ngemihla: 15% (enkosi kulawulo lwamandla oluchanekileyo)
VII. Iingcebiso zokukhetha
Icetyiselwe ukusetyenziswa ngokubaluleka kwezi meko zilandelayo:
Kufuneka uprinte iimpawu ezichasene nenkohliso yenqanaba lemicron (ezifana neekhowudi ezingabonakaliyo)
Indawo yoshishino kunye ne-7 × 24 iiyure zemveliso eqhubekayo
Iinkqubo ezizinzisiweyo ezinemithintelo yendawo (ubukhulu yi-9.8mm kuphela)
Iimeko ezifuna ukuthotyelwa kwe-FDA 21 CFR iSigaba se-11
Lo mzekelo wamkelwe ngaphezu kwe-200 yabavelisi bezixhobo zonyango zehlabathi, kwaye isabelo sayo semarike kwicandelo lesixhobo se-IVD sifikelele kwi-37% (idatha ye-Q2 2024). I-teknoloji yokulinganisa i-thermal yokulinganisa i-patent (inombolo ye-patent: JP2022-185634) iqinisekisa uzinzo kwi-high-speed yoshicilelo kwaye isisombululo soqoqosho sokutshintsha ukuphawula kwe-laser yendabuko.