en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The Yamaha YS24X combines high-speed chip placement with the flexibility to mount larger and irregularly shaped components. Two independent beams carry 10-nozzle in-line heads, delivering up to 54,000 CPH under Yamaha’s optimum conditions.
Its component capability extends to 45 × 45 mm packages and parts up to 15 mm high. This makes the YS24X suitable for boards combining chip components with larger devices, rather than restricting the machine to small-component placement.
Large-board capability in a compact platform
The 1.25 m-wide platform accommodates PCBs up to 700 × 460 mm. Component recognition and lighting systems support solder-ball inspection and optional coplanarity checking. A large nozzle station accommodates different pickup requirements.
For tray-fed devices, the optional sATS supply system provides automatic exchange using two magazine racks with 15 pallets each.
Key Equipment Specifications
| Elemento | Especificación |
|---|---|
| Modelo | Yamaha YS24X |
| Head arrangement | Two independent beams, two 10-nozzle heads |
| Optimum placement speed | 54,000 CPH |
| Maximum PCB size | 700 × 460 mm |
| Maximum component footprint | 45 × 45 mm |
| Maximum component height | 15 mm |
| Platform width | Approximately 1.25 m |
| Tray handling option | sATS automatic tray supply |
