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The Yamaha YS24X combines high-speed chip placement with the flexibility to mount larger and irregularly shaped components. Two independent beams carry 10-nozzle in-line heads, delivering up to 54,000 CPH under Yamaha’s optimum conditions.
Its component capability extends to 45 × 45 mm packages and parts up to 15 mm high. This makes the YS24X suitable for boards combining chip components with larger devices, rather than restricting the machine to small-component placement.
Large-board capability in a compact platform
The 1.25 m-wide platform accommodates PCBs up to 700 × 460 mm. Component recognition and lighting systems support solder-ball inspection and optional coplanarity checking. A large nozzle station accommodates different pickup requirements.
For tray-fed devices, the optional sATS supply system provides automatic exchange using two magazine racks with 15 pallets each.
Key Equipment Specifications
| Artículo | Especificación rehegua |
|---|---|
| Techapyrãramo | Yamaha YS24X |
| Head arrangement | Two independent beams, two 10-nozzle heads |
| Optimum placement speed | 54,000 CPH |
| Maximum PCB size | 700 × 460 mm |
| Maximum component footprint | 45 × 45 mm |
| Maximum component height | 15 mm |
| Platform width | Approximately 1.25 m |
| Tray handling option | sATS automatic tray supply |
