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Heller 1809EXL SMT Reflow Soldering Oven

Heller 1809EXL SMT Reflow Soldering Oven

Explore the Heller 1809EXL with nine upper and lower heating positions, two cooling zones and air or nitrogen configurations. Request equipment pricing.

Quick Ufro Email:smt-sales9@gdxinling.cn
Detailer

The Heller 1809EXL provides a nine-position heating layout and two cooling zones in a 4.65-metre oven. Its convection heating platform supports both eutectic and lead-free soldering processes.

Air and nitrogen versions are available. In the published nitrogen configuration, the first heating position incorporates infrared heating, so the installed heater arrangement should be distinguished from the all-convection air version.

The platform includes five-thermocouple profiling and process logging, giving engineers a way to relate oven settings to measured PCB temperatures. Automatic conveyor lubrication and a powered hood lift support routine operation and service.

Our 1809EXL offer identifies the atmosphere version, conveyor arrangement and included profiling equipment.

Heller 1809EXL Core Technical Specifications

ParameterSpezifizéierung
Modell1809EXL
Process AtmosphereAir or nitrogen, depending on version
Heating Layout — Air Version9 upper / 9 lower convection zones
Heating Layout — Nitrogen Version8 convection + 1 IR position, upper and lower
Standard Cooling Zones2
Standard Temperature Range25–350°C
Standard PCB Width RangeApproximately 50–508 mm
Clearance Above / Below Conveyor PinsApproximately 29 mm / 29 mm
Overall Dimensions, L × W × HApproximately 4,650 × 1,370 × 1,600 mm
Net WeightApproximately 1,800 kg

Figures refer to the published EXL configuration. Extended board handling and optional equipment require separate confirmation.

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Kontaktadress:Nr 18, Shangliao Industrial Road, Shajing Town, Baoan Distrikt, Shenzhen, China

Telefonsnummer vun der Consultatioun:+86 13823218491

E-Mail:smt-sales9@gdxinling.cn

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