Ebikwata ku Hanwha SP1-C solder paste printer n’ebintu ebigikwatako bye bino wammanga:
Ebikwata ku nsonga eno
Obutuufu bw’okukuba ebitabo: ±12.5μm@6σ
Sipiidi y’okukuba ebitabo: sekondi 5 (nga tobaliddeemu budde bwa kukuba)
Sayizi ya stencil: Esinga obunene mm 350 x mm 250
Sayizi ya stencil: mm 736 x mm 736
PCB processing size: Ekisinga obunene 330mm x 250mm (omukutu gumu) / 330mm x 250mm (omukutu ebiri, okwesalirawo)
Obudde bw’enzirukanya y’okukuba ebitabo: sekondi 5 (nga tobaliddeemu kukuba ebitabo)
Ebintu ebikola Obutuufu obw’amaanyi: Obutuufu bw’okukuba ebitabo butuuka ku ±12.5μm@6σ, okukakasa omutindo gw’okukuba ebitabo
Obulung’amu obw’amaanyi: Sipiidi y’okukuba ebitabo ya sikonda 5, esaanira ebyetaago by’obusobozi bw’okufulumya obw’amaanyi
Versatility: Ewagira dual-track straight-through production, esaanira okufulumya mixed-flow
Automation omulimu: Equipped ne SPI feedback, automatic ekyuma mesh okukyusa / okuteeka, kyangu okukola
Okutebenkera: Ebyuma biba n’obutebenkevu obulungi era bisaanira okukolebwa obutasalako okumala ebbanga eddene
Obusobozi bw’okufulumya obw’amaanyi: Busaanira ebyetaago by’okufulumya ebintu ebinene, obusobozi bw’okufulumya obw’amaanyi era obutebenkevu