Mafotokozedwe ndi mawonekedwe a chosindikizira cha Hanwha SP1-C solder paste ndi motere:
Zofotokozera
Kulondola kosindikiza: ±12.5μm@6σ
Liwiro losindikiza: 5 masekondi (kupatula nthawi yosindikiza)
Kukula kwa stencil: Zolemba malire 350mm x 250mm
Kukula kwa stencil: 736mm x 736mm
PCB processing kukula: Zolemba malire 330mm × 250mm (njira imodzi) / 330mm x 250mm (wapawiri njira, optional)
Nthawi yosindikiza: 5 masekondi (kupatula kusindikiza)
Zomwe zimagwirira ntchito Kulondola kwambiri: Kulondola kosindikiza kumafika ±12.5μm@6σ, kuwonetsetsa kuti kusindikiza kuli bwino.
Kuchita bwino kwambiri: Liwiro losindikiza ndi masekondi a 5, oyenera pazofunikira zazikulu zopanga
Kusinthasintha: Imathandizira kupanga njira ziwiri zowongoka, zoyenera kupanga mosakanikirana
Ntchito yodzichitira: Yokhala ndi mayankho a SPI, kusintha / kukhazikitsa kwachitsulo, kosavuta kugwiritsa ntchito
Kukhazikika: Zidazi zimakhala ndi kukhazikika bwino ndipo ndizoyenera kupanga nthawi yayitali
Kuthekera kwakukulu kopanga: Kukwanira pazosowa zazikulu zopanga, kutulutsa kwakukulu komanso kokhazikika