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The Yamaha YSM10 combines a compact machine body with an HM placement head that handles both small chips and larger components. With the ten-nozzle HM head, its optimum placement rating reaches 46,000 CPH, making it a practical option when floor space limits the size of a production-line expansion.
Component coverage is another reason to consider the YSM10. The platform supports packages from metric 03015 chips to components measuring up to 55 × 100 mm, with component heights up to 15 mm. Larger and taller parts require the appropriate optional multi-camera configuration.
This gives the YSM10 a broader role than chip placement alone. A mixed assembly can be evaluated on one platform, with the head, camera and feeding arrangement matched to the component list. We quote the installed head and camera options clearly so buyers can distinguish the machine’s actual capability from the platform’s maximum specification.
Yamaha YSM10 SMT Placement Machine Specifications
| Tūemi | Nga korero |
|---|---|
| Placement speed | Up to 46,000 CPH with ten-nozzle HM head, optimum conditions |
| Alternative head | Five-nozzle HM5, up to 31,000 CPH |
| Standard PCB size | 50 × 50 to 510 × 460 mm |
| Component range | Metric 03015 to 55 × 100 mm, configuration dependent |
| Maximum component height | 15 mm |
| Camera requirement | Optional multi-camera for components over 12 mm or 6.5 mm high |
