en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
ASMPT's AUTOPIA-TCT is a die bonder. AUTOPIA-TCT is a die bonder provided by ASMPT, mainly used for semiconductor packaging overall solutions. The equipment has the following features:
FOV up to 2100 during testing, capable of providing high-precision test results.
11 degrees of freedom, which can improve calibration quality.
Highly configurable settings, suitable for different production needs.
Easily switch between high-volume or high-UPH production sequences to improve production efficiency.
Provide a wide range of user-defined process parameters to meet diverse production needs.
Sensor leveling greatly improves calibration results and ensures test accuracy.
Automatic and precise loading/unloading for high-volume production.
Can be expanded for online use to adapt to different production environments.
Production cleanliness reaches Class 100 to ensure the cleanliness of the production environment.
