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Fico Molding line AMS-LM

Fico Molding line AMS-LM

The main function of BESI’s AMS-LM machine is to process large substrates and provide high productivity and good performance and output‌. The machine is capable of processing 102 x 280 mm substrates a

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Details

The main function of BESI's AMS-LM machine is to handle large substrates and provide high productivity and good performance and yield. The machine can handle substrates of 102 x 280 mm and is suitable for all current single-sided and double-sided packages.

Features and effects

Handling large substrates: The AMS-LM series is capable of handling large substrates, meeting the needs of modern electronic manufacturing for larger substrates.

High productivity: Through an efficient molding system, the machine can significantly improve production efficiency and ensure high-quality output.

Performance and yield: The use of large substrates and high productivity together ensure better performance and higher yield

The BESI AMS-LM TopFoil chip molding system has a TopFoil function that enables the production of bare chip products without overflow. The TopFoil special foil is guided above the mold to form a soft cushion that prevents the chip from being covered with compound, eliminating the need for an additional cleaning step‌

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Fico Molding line AMS-LM FAQ

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