SONY SI-F209 SMT machine completes the SMT operation through the following steps:
Component Pickup: The SMT head picks up components through a vacuum nozzle, and the nozzle must move quickly and smoothly in the Z direction.
Positioning and Placement: The SMT head moves in the X-Y direction, accurately positioned by the servo system, and then places the component on the specified position of the substrate.
Optical recognition and adjustment: The optical recognition system ensures the accurate placement of components, and the servo mechanism and computer image processing technology further ensure the accuracy of the patch. The specifications and functions of Sony SI-F209 patch machine are as follows:
Specifications
Equipment size: 1200 mm X 1700 mm X 1524 mm
Equipment weight: 1800kg
Power supply requirements: AC three-phase 200V±10% 50/60Hz 2.3KVA
Air source requirements: 0.49~0.5MPa
Functions and functions
Sony SI-F209 patch machine is based on the best-selling SI-E2000 series design for many years. The mechanical design is compact and suitable for precision pitch placement equipment. It is not only suitable for the same chip parts as the E2000 series, but also for large connectors, and the applicable parts field is greatly expanded. In addition, F209 adopts a new image processing system to speed up image processing, shorten the part placement time, and reduce the part data generation time.