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VCTA-V850 is a solder paste thickness detector, which is mainly used to detect the thickness of solder paste and ensure the quality of patch processing.
High-precision detection: Mirtec SPI MS-11e is equipped with a 15-megapixel camera, which can achieve high-precision 3D detection. Its height resolution reaches 0.1μm, height accuracy is 2μm, and he
Supports three resolutions of 7μm, 12μm, and 18μm, suitable for high-precision solder paste inspection needs.
KY8030-3 can meet the 01005 detection speed standard and has high-speed detection capabilities
TR7007Q SII is a high-performance solder paste printing inspection equipment
Provides full 3D inspection, and the optical resolution can be selected as 10µm or 15µm to ensure high-precision inspection results.
Both X/Y axes are equipped with linear motors, with a motion accuracy of ±3um to ensure the accuracy of detection.
Bentron SPI 7700E adopts 2D+3D algorithm, which can provide high-precision solder paste thickness detection to ensure welding quality
The SE600 is CyberOptics' flagship model and is part of the SPI system. It brings together the highest accuracy and world-class serviceability to provide a high-performance platform
Koh Young SPI 8080 is able to achieve the fastest inspection in the industry while maintaining high accuracy
PARMI HS70 series uses the speed RSC_6 sensor, which shortens the entire detection time
The PARMI 3D HS60 solder paste inspection system has good measurement speed and resolution
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