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The advantages and specifications of the Keyang SPI KY8030-3 are as follows:
Advantages
Detectable: KY8030-3 can meet the 01005 detection speed standard and has high-speed detection capabilities. It can detect and compensate for board bending in real time without increasing detection.
Real-time detection and compensation technology: The device uses SPI technology with 2D+3D technology, which can detect and compensate for board bending in real time, providing more accurate detection results.
Multi-device connection: Supports connection technology with other well-known equipment, such as printers, placement machines, AOI, etc., which improves the overall efficiency and coordination of the production line.
Specifications
Measurement range: ±0.002mm
Power supply voltage: 2.2kwV
Dimensions: 705×1200×1540mm
Weight: 500kg
Application range
KY8030-3 is suitable for circuit boards and welding, semiconductors, packaging, printing and other fields
