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Koh Young SPI 8080 is a 3D solder paste tester with the following features and specifications:
Features
High-precision inspection: Koh Young SPI 8080 is able to achieve the fastest inspection in the industry while maintaining high accuracy, with a full 3D inspection speed of 38.1 cm²/sec
High resolution: The device has a resolution of 1.0um/pulse and uses a 4-megapixel camera for image acquisition
Versatility: Capable of solder paste thickness measurement and 3D testing, measurement values can be recorded, archived and printed, and has strong vibration resistance
Specifications Parameters Power supply requirements: 200-240VAC, 50/60Hz single phase
Air source requirements: 5kgf/cm² (0.45MPa), 2Nl/min (0.08cfm)
Weight: 600kg
Dimensions: 1000x1335x1627mm
PCB size: 50×50～510×510mm
Measurement range: 0.6mm~5.0m
Height accuracy: 1μm (correction module)
Maximum detection size: 10 × 10 mm
Application scenarios and price information
Koh Young SPI 8080 is suitable for SMT production lines for precise detection and quality control of solder paste thickness.
