en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
HELLER Reflow Oven 1911MK5-VR is a highly efficient device designed for demanding lead-free applications, with multiple temperature control points and flexible heating zone design to meet different temperature process requirements. The equipment can effectively eliminate voids, and the total void area can be controlled below 1%, significantly improving production efficiency and quality
Technical specifications and performance parameters Heating length: 382 cm (150 inches), suitable for mass production
Heating area: Contains 11 convection zones and 3 infrared heating zones, which can flexibly subdivide profiles into smaller parts to meet complex manufacturing needs
Cooling system: Equipped with advanced cooling systems, such as water-cooled "condensation ducts", to ensure efficient cooling and maintenance-free design
Monitoring system: Built-in product process monitoring and traceability functions to improve production management level and ensure stable product quality
Application scenarios and user reviews
HELLER 1911MK5-VR vacuum reflow oven is widely used in the electronics manufacturing industry, especially in the semiconductor packaging and TIM/lid pasting industries. Its efficient, flexible and reliable performance is deeply trusted by electronics manufacturing companies, helping companies to achieve automation and traceability of the production process, improve efficiency and reliability
