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A maximum printing area of 1,000 × 610 mm gives the EKRA SERIO 8000 a clear role in large-format production. Its substrate range includes PCBs, glass and ceramics, with printing capability for solder paste and adhesive.
Large substrates require controlled alignment and pressure
The EVA vision system uses two cameras for alignment, including applications with low-contrast features. Pneumatically controlled squeegee pressure supports consistent material transfer across the printing area.
Stencil frame compatibility is an important part of machine selection: the SERIO 8000 accepts substantially larger frames than standard PCB stencil printers.
EKRA SERIO 8000 Core Technical Data
| Parameter | Specification |
|---|---|
| Maximum print area | 1,000 × 610 mm |
| Minimum substrate size | 100 × 100 mm |
| Substrate thickness | 0.5–6 mm |
| Stencil frame range | 540 × 540 to 1,270 × 1,700 mm |
| Alignment repeatability | ±12.5 μm at 6 sigma |
| Base cycle time | 15 seconds, excluding printing |
| Printing speed | 9–200 mm/s |
| Machine dimensions, L × W × H | 1,650 × 1,856 × 1,550 mm |
