ISAKI 3Di-LD2yinkqubo ye-3D echanekileyo yokuhlola i-automated optical inspection (AOI) eyenzelwe imigca yemveliso ye-SMT yanamhlanje.
Yenzelwe ukuhlola amalungu e-solder, amacandelo, kunye nemiphezulu ye-PCB ngokuchaneka okukhethekileyo kunye nesantya.
Iquka i-SAKI ye-3D yobugcisa bokwenza imifanekiso ephucukileyo, i-3Di-LD2 iqinisekisa ukubhaqwa kwesiphako esichanekileyo ngelixa igcina imveliso ephezulu, iyenza ilungele imveliso yobuninzi kunye nomxube ophezulu wokusingqongileyo.

Uyilo oludityanisiweyo kunye ne-algorithms yokuhlola ekrelekrele ivumela ukuba idityaniswe ngaphandle komthungo kwiinkqubo ezingaphakathi, ibonelela ngokusebenza okungaguquguqukiyo nokuthembekileyo kokuhlola kuyo yonke iPCB.
Iimpawu eziphambili zeSAKI 3Di-LD2 3D AOI System
1. Ukuchaneka koHlolo lwe-3D oluyinyaniso
I-SAKI 3Di-LD2 ithatha imifanekiso ye-3D eyinyani yazo zonke i-solder joint kunye necandelo usebenzisa i-projectionion ye-high-speed kunye nenkqubo yeekhamera ezininzi.
Ibona ukuguquguquka kobude, ibhulorho ye-solder, izinto ezingekhoyo, kunye nemicimbi ye-coplanarity ngokuchaneka kwenqanaba le-micrometer.
2. Ukusebenza koHlolo oluPhezulu
Ixhotyiswe ngeteknoloji ye-SAKI yokusetyenzwa kwe-parallel, i-3Di-LD2 ibonelela ngesantya sokuhlola ukuya kuma-70 cm²/sec ngaphandle kokubeka esichengeni ukuchaneka.
Oku kuyenza ilungele imigca ye-SMT ekhawulezayo efuna ukuchaneka kunye nemveliso.
3. Ukuqhubekeka kweMifanekiso ye-3D ekwinqanaba eliphezulu
I-injini ye-imaging ye-3D ye-high-resolution yenkqubo iphinda iphinde idibanise i-solder nganye ngokuphakama okupheleleyo kunye nokuma, ivumela umlinganiselo ochanekileyo wevolumu, indawo, kunye nokuphakama-imilinganiselo engundoqo yokuqinisekisa umgangatho othembekileyo.
4. Easy Operation and Programming
Ujongano lwesoftware ye-SAKI ibonelela ngokuyilwa kwenkqubo ecacileyo kunye neetemplates zokuhlola eziguquguqukayo. Abaqhubi banokumisela iimeko zokuhlola ngokukhawuleza usebenzisa idatha yeCAD okanye ukungenisa kweGerber, ukunciphisa ixesha lokucwangcisa.
5. Ukudityaniswa kweNkqubo ye-Inline
I-3Di-LD2 idibanisa ngokulula kunoma yimuphi umgca wemveliso ye-SMT kwaye isekela unxibelelwano olupheleleyo kunye nokubekwa, ukugeleza kwakhona, kunye neenkqubo ze-MES. Inokwenza ngokuzenzekelayo idatha yokuhlola ingxelo yokulungiswa kwenkqubo evaliweyo.
6. Uyilo oluQinisekileyo kunye noluQonce
Nangona i-compact footprint, i-3Di-LD2 inikezela ukuzinza kwe-industrial-grade kunye nokuqina koomatshini. Igcina ukuchaneka kwexesha elide lokulinganisa, nakwiindawo ezinomthamo ophezulu.
SAKI 3Di-LD2 IiNgcaciso zobuGcisa
| Ipharamitha | Inkcazo |
|---|---|
| Umzekelo | SAKI 3Di-LD2 |
| Uhlobo loHlolo | 3D Automated Optical Inspection |
| Isantya sokuhlola | Ukuya kuthi ga kwi-70cm²/umzuzwana |
| Isigqibo | 15µm/pixel |
| Uluhlu loMlinganiso woMde | 0 - 5 mm |
| Ubungakanani bePCB | Max. 510 × 460 mm |
| Ubude becandelo | Ukuya kuthi ga kwi-25 mm |
| Izinto Zokuhlola | I-Solder joint, ilahlekile, i-polarity, i-bridging, i-offset |
| Ukunikezwa Amandla | AC 200–240 V, 50/60 Hz |
| Uxinzelelo loMoya | 0.5 MPa |
| Ubungakanani bomatshini | 950 × 1350 × 1500 mm |
| Ubunzima | Malunga. 550 kg |
Iinkcukacha zinokwahluka ngokuxhomekeke kubumbeko.
Usetyenziso lwe-SAKI 3Di-LD2 AOI Machine
I-SAKI 3Di-LD2 ilungele uluhlu olubanzi lwe-SMT kunye nezicelo zokwenziwa kombane, kubandakanya:
Ukuhlolwa kwe-post-solder kunye ne-post-placement
Iindibano zePCB ezinoxinano oluphezulu
Iimoto ze-elektroniki
Iinkqubo zolawulo lwamashishini
I-LED kunye nokuhlolwa kwemodyuli yokubonisa
Unxibelelwano kunye nokuveliswa kwezixhobo zonyango
Isebenza ngokukodwa kwimigca yemveliso efuna umlinganiselo ochanekileyo we-3D kunye nolawulo lwenkqubo yexesha langempela.
Izinto ezilungileyo ze-SAKI 3Di-LD2 3D AOI Machine
| Inzuzo | Inkcazo |
|---|---|
| Ukuchaneka okuphezulu koMlinganiselo we-3D | Ibamba ubude bokwenyani kunye nedatha yevolumu yovavanyo oluchanekileyo lwe-solder. |
| UPhumezo olukhawulezileyo | Igcina uhlolo olukhawulezayo ngokuchaneka okungaguqukiyo. |
| Ukufunyanwa kweSiphene okuthembekileyo | Ichonga izinto ezingekhoyo, ezingalungelelaniswanga kakuhle, okanye zinyuswe kakuhle. |
| Ukuhlanganiswa okulula | Ixhasa unxibelelwano lwe-intanethi kunye ne-MES kunye neenkqubo zokubeka. |
| Umsebenzi oLungeneyo umsebenzisi | Ukuseta lula kunye nokulinganisa okuzenzekelayo kunciphisa umsebenzi wabasebenzisi. |
ULondolozo kunye neNkxaso
I-SAKI 3Di-LD2 yenzelwe ukugcinwa lula kunye nokuzinza kwexesha elide.
Inkonzo yesiqhelo ibandakanya:
Ukulinganisa ikhamera kunye neprojekti yokulinganisa
I-Lens kunye nokucoca indlela yokubona
Uhlaziyo lwenguqulelo yesoftware
Ukuqinisekiswa kokulungelelaniswa koomatshini
GEEKVALUEibonelela ngenkxaso epheleleyo yobugcisa, kubandakanywa ukufakela, ulungelelwaniso, kunye noqeqesho kwisiza. Iindawo ezisecaleni kunye nezicwangciso zenkonzo ziyafumaneka ukuze uqinisekise ukuba inkqubo yakho yokuhlola isebenza ngokuphezulu.
Imibuzo ebuzwa qho
Q1: Yintoni eyenza i-SAKI 3Di-LD2 yahluke kwezinye iinkqubo ze-3D AOI?
Inikezela ngohlolo lwe-3D lokwenyani kunye nomgangatho wokwenyani wokulinganisa endaweni ye-pseudo-3D imaging, iqinisekisa ukuchaneka okuphezulu kwe-solder joint kunye nokuqinisekiswa kwecandelo.
I-Q2: Ngaba iyakwazi ukubona i-coplanarity kunye nemiba yevolumu ye-solder?
Ewe. Inkqubo ilinganisa ubude bokwenyani kunye nomthamo wejoyinti ngalinye le-solder, ukuchonga ukungonelanga okanye okugqithisileyo kunye neziphene ze-coplanarity.
I-Q3: Ngaba i-3Di-LD2 iyahambelana nesoftware yokudibanisa umgca we-SMT?
Ngokuqinisekileyo. Ixhasa iiprothokholi zonxibelelwano ezisemgangathweni ze-MES, ukubekwa, kunye neenkqubo zokuqukuqela kwakhona, ivumela ulawulo olupheleleyo lwengxelo evaliweyo.
Ukukhangela ukuchaneka okuphezuluSAKI 3Di-LD2 3D AOI Machinekumgca wakho we-SMT?
GEEKVALUEinikeza intengiso, ukuseta, ulungelelwaniso, kunye nenkxaso emva kokuthengisa kwiinkqubo zokuhlola ze-SAKI AOI kunye nezinye izixhobo ze-SMT.
FAQ
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Yintoni eyenza i-SAKI 3Di-LD2 yahluke kwezinye iinkqubo ze-3D AOI?
Inikezela ngohlolo lwe-3D lokwenyani kunye nomgangatho wokwenyani wokulinganisa endaweni ye-pseudo-3D imaging, iqinisekisa ukuchaneka okuphezulu kwe-solder joint kunye nokuqinisekiswa kwecandelo.
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Ngaba inokubona i-coplanarity kunye nemiba yevolumu ye-solder?
Ewe. Inkqubo ilinganisa ubude bokwenyani kunye nomthamo wejoyinti ngalinye le-solder, ukuchonga ukungonelanga okanye okugqithisileyo kunye neziphene ze-coplanarity.
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Ngaba i-3Di-LD2 iyahambelana nesoftware yokudibanisa umgca we-SMT?
Ngokuqinisekileyo. Ixhasa iiprothokholi zonxibelelwano ezisemgangathweni ze-MES, ukubekwa, kunye neenkqubo zokuqukuqela kwakhona, ivumela ulawulo olupheleleyo lwengxelo evaliweyo.
