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I-K&S Katalyst™ sisixhobo sokupakisha se-flip chip esineempawu zofakelo olulula kunye nesantya esikhawulezayo sokuvelisa.
Imisebenzi ephambili kunye neenkcukacha zeKatalyst™ ziquka:
I-Katalyst™ iyakwazi ukufezekisa i-3μm ye-workpiece echanekileyo, elelona nqanaba liphezulu elakhelwe ngaphakathi
Isantya esiphezulu: Umthamo wayo wokuvelisa ngoko nangoko unokufikelela kwi-15,000UPH, elingana nokuphinda kabini umthamo wemveliso yefektri.
Uluhlu lwesicelo: Isixhobo sifanelekile ukupakishwa kwe-flip chip kwiibhodi ze-motherboard okanye ii-wafers, ngakumbi kwiimeko zesicelo sobuchwepheshe obuvelayo obufana ne-5G kunye ne-Intanethi yezinto.
Iimeko ezikhethekileyo zosetyenziso kunye nethemba loshishino lweKatalyst™:
Ukusetyenziswa kwixesha le-5G: Ngophuhliso lwetekhnoloji ye-5G, ukusetyenziswa kwenkqubo yokupakishwa kwe-flip chip kwiimveliso zoyilo ze-ultra-thin ezinje ngee-smartphones, iitafile, kunye neekhompyuter ziya kwanda, kwaye i-wafer kunye nesantya esiphezulu sokupakishwa kwezixhobo ze-Katalyst iinzuzo ezibalulekileyo kwezi zicelo
