en
ori
alb
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arm
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aze
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glg
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hkm
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ice
id
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kin
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mao
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mlt
nep
nl
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orm
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Izinto eziluncedo zePCB eziqhekezayo ziquka le miba ilandelayo:
Ukuphucula ukusebenza kakuhle kwemveliso: Izahluli ezizenzekelayo zinokuphucula kakhulu ukusebenza kakuhle kwemveliso. Ngokomzekelo, i-SCHUNK splitter inokugqiba ngokulula ukuhlukana kweebhodi zesekethe ze-200-300 ngeyure, engaphezulu kwe-80% esebenzayo ngaphezu kweebhodi ze-50-80 ezinokwahlulwa ngesandla.
Qinisekisa umgangatho wemveliso: Xa ukwahlula iibhodi zesekethe zePCB, i-automatic splitter inokusika ngokuchaneka okuphezulu kakhulu, kwaye impazamo inokulawulwa ngaphakathi kwe-± 0.1 mm, ukuphepha imikrwelo, iintanda kunye nomnye umonakalo, ukunciphisa izinga lemveliso, kunye nokuphucula abaqeqeshiweyo. izinga kunye nokuthembeka kweemveliso
Ukulungelelanisa inkqubo yokuvelisa i-SMT: Kwinkqubo yokuvelisa i-SMT (i-teknoloji ye-surface mount), i-splitter inokusebenzisana ngokugqibeleleyo nezinye izixhobo kumgca wokuvelisa ukuqinisekisa ukuba iibhodi zeesekethe ze-PCB zihlanganiswe kakuhle kwaye zivavanywa kwiikhonkco ezilandelayo.
Iindidi ezininzi onokukhetha kuzo: Kukho iintlobo ezininzi ze-PCB eziqhekezayo, kuquka uhlobo lwesisiki sokusila, uhlobo lwesitampu kunye ne-laser splitter. Uhlobo ngalunye luneenzuzo zalo ezizodwa:
I-Milling cutter yohlobo lwe-splitter: Ifanelekile kwiibhodi zesekethe zePCB zeemilo ezahlukeneyo kunye nobukhulu, akukho burrs kumda wokusika, uxinzelelo oluphantsi.
I-Punching type splitter: Ixabiso eliphantsi lotyalo-mali lokuqala kunye nesantya esikhawulezayo, kodwa ixabiso eliphezulu kamva kunye nokuveliswa koxinzelelo
I-Laser splitter: Idibanisa izibonelelo ze-milling cutter yohlobo lwe-splitter, inokwenza i-micro-cutting, akukho xinzelelo, kodwa umatshini uyabiza.
