en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
Izibonelelo ze-ASMPT wire bonder AB383 ikakhulu ziquka ukuchaneka, ukuzinza kunye nokusebenza okuphezulu. Ukuma kwayo okuchanekileyo kunye netekhnoloji ye-welding inokuqinisekisa ukuwelda okuchanekileyo kwezinto ezincinci, kwaye ukuhamba kwayo okusebenzayo kunokuphucula kakhulu ukusebenza kakuhle kwemveliso.
Iinzuzo ezithe ngqo Ukuchaneka: I-AB383 ye-wire bonder ine-high-precision positioning system, enokuqinisekisa ukuchaneka ngexesha lenkqubo ye-welding kwaye ifanelekile kwiimfuno ze-welding zezinto ezincinci. Ukuzinza: I-wire bonder yenza kakuhle ekusebenzeni kwexesha elide kwaye inozinzo oluphezulu, olunokuqinisekisa ukuqhubeka nokuthembeka kwenkqubo yokuvelisa. Ukusebenza okuphezulu: Uyilo olusebenzayo lokuhamba komsebenzi luphucula kakhulu ukusebenza kwemveliso kwaye lufanelekile kwiimfuno ezinkulu zemveliso. Iimeko zesicelo I-AB383 yocingo lwe-bonder isetyenziswa ikakhulu kwizixhobo zokupakisha ze-semiconductor ze-LED, ngakumbi kwisixhobo sokubopha i-LED. Ilungele iimeko ezahlukeneyo zokupakishwa kwe-semiconductor ye-LED kwaye inokuhlangabezana neemfuno zemveliso yokuchaneka okuphezulu kunye nokusebenza okuphezulu.
